CMP是什么意思
网络释义：冠军；共中心点；金属波纹管；凸轮轴转角传感器
1 . The CMP process is also used to control film thickness and removal of barrier layers.
CMP技术也用于控制薄膜厚度及剥离隔离层.
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2 . The copper chemical - mechanical polishing ( CMP ) which is the key planarization technology for ULSI manufacturing was discussed.
对用于甚大规模集成电路(ULSI) 制造的关键平坦化工艺———铜化学机械抛光 ( CMP) 技术进行了讨论.
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3 . Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.
为模拟cmp磨料 分配系统的粒子减少开发了数字模型.
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4 . Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.
最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.
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5 . This article take the technology of the single chip multi - processor ( CMP ) as a master line.
以单芯片 多处理器 ( CMP) 技术为主线,综述了多核架构未来发展趋势及其技术走向.
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